PCB LAYOUT AUTHORITY

SuperSpeed USB 3 Design Guide

Published on 2011-09-16 19:12:00

IntroductionSuperSpeed USB (USB 3.0) delivering data rates up to 5Gbps which is ten times faster than Hi-Speed USB (USB 2.0) with optimized power efficiency. At these high transmission rates, signal integrity issues become increasingly restrictive on PCB trace and cable lengths, and on design implementation and features. Poor signal quality can significantly impact system performance and reliability.SuperSpeed (USB 3.0) ReDriver in Source ApplicationSuperspeed is a dual channel (TX± and RX±),

Capacitive Touch Sensing Layout Guidelines --- > Part 1

Published on 2011-08-26 19:11:00

Capacitive Sensing Capacitive sensing is the art of measuring a relatively very small variation of capacitance in a noisy environment. To illustrate the principle of capacitive sensing we will use the typical simplest button implementation below but the same basic laws apply to more complex capacitive structures like sliders or wheels. Figure shows cut view and top view of a typical capacitive button implementation. The sensor connected is a simple round copper area on top layer of the PCB. I

Capacitive Touch Sensing Layout Guidelines --- > Part 2

Published on 2011-08-26 19:10:00

Buttons Introduction Similarly to the mechanical buttons they intend to replace, touch buttons provide ON/OFF information i.e. respectively button touched or not touched by the finger. Each touch button is associated to its dedicated capacitive sensor. Shape Round is best while oval or square with round corners are also acceptableAny other shape with acute angles is not recommendedPossibility to put a hole for reverse mount SMD LED in the middle (will reduce a little bit the sensor surface, c

Free Webinars for Hardware and PCB Engineers

Published on 2011-07-25 17:32:00

Free Webinars for Hardware and PCB EngineersGoto WebinarEnhancing Multi-Gbps Simulations With The New HyperLynx 3D Full-wave SolverGoto WebinarSystem Level Power Considerations for PCB DesignGoto WebinarAddressing Complex Technology Challenges with the PADS FlowGoto WebinarHyperLynx Analog On-Demand Web Seminar Session 1HyperLynx Analog On-Demand Web Seminar Session 2Goto WebinarMulti-Gbps Serial Channel (SERDES) Design SolutionsGoto WebinarPCI Express Basics: Developing Physical Design Rules fo

Touch Sensor PCB and Layout Guidelines Part 1

Published on 2011-04-14 18:12:00

IntroductionThis note provides guidelines for the construction and the layout of different types of printed circuit boards (PCBs) for the implementation of the Touch Sensor Controller (TSC) capacitive sensors on substrate materials such as FR4, flexible PCBs, or ITO panels. Various substrate materials are available for different PCB design construction. Among the substrate materials currently available on the market, the FR4 is the most common. FR4 is a glass fiber epoxy laminate and PCBs can ha

Touch Sensor PCB and Layout Guidelines Part 2

Published on 2011-04-13 05:38:00

PCB Layout TipsThis section provides guidelines on the design and layout related to several types of PCBs. See Figure 8.The important task in PCB design is to draw sensor lines to reduce influence from internal and/or external noise sources. The types of noise sources and suggested design guidelines are described next.Single Layer PCB ConstructionA capacitive touch module can be designed in a singlelayer FR4 PCB of standard thickness (1.6mm). See Figure 9. The electrode and all the components ar

Chip Antenna Mounting and Tuning Techniques

Published on 2010-09-17 23:01:00

Chip Antenna Mounting and Tuning TechniquesMotivationChip Antenna an efficient means of "connectivity" to modern portable electronic devices.Miniature portable devices requires small antennas.Can be internalized – i.e. "Concealed" within adevice.ProsChip antennas are small, cheap and perform well.Bulky external "whip" type antennas are a thing of the past.ConsMust be accounted for during initial circuit design stageInterference, proximity de-tuning & degradation concerns.Chip Antenna Chara

HDMI Design Guidelines -- > Layer Stack-up, Differential Pair

Published on 2010-04-24 02:31:00

IntroductionThis article presents design guidelines for helping users of HDMI mux-repeaters to maximise the device’s full performance through careful printed circuit board (PCB) design. We’ll explain important concepts of some main aspects of high-speed PCB design with recommendations.This discussion will cover layer stack, differential traces, controlled impedance transmissionlines, discontinuities, routing guidelines, reference planes, vias and decoupling capacitors.Layer stackThe pin-out

HDMI Design Guidelines -- > Control Impedance, Discontinuities

Published on 2010-04-24 02:20:00

Controlled Impedance Transmission LinesControlled impedance traces are used to match the differential impedance of the transmission medium, e.g., cables, and the termination resistors. Differential impedance is determined by the physical geometries of the signal pair traces, their relation to the adjacent ground plane and the PCB dielectric. These geometries must be maintained across the entire trace length.A more accurate, and in the long term cheaper approach, is to use a 2D or better field so

Chip Antenna Layout Considerations for 802.11 Applications

Published on 2010-03-07 17:05:00

Chip Antenna matching and radiation pattern performance can be dramatically affected by the design/layout of a circuit. Antenna mounting, the antenna’s position relative to circuit mismatches, the antenna position relative to adjacent components and ground planes all can affect antenna performance. Thus design engineers must use care when creating a circuit layout which includes an antenna.Because of the effect of these subtleties, antennas mounted in a specific application are likely to exhib